-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueBreaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
Level Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
SEMI Applauds U.S. CHIPS Act Award for TSMC Manufacturing Facilities to Strengthen Domestic Semiconductor Supply Chain
April 9, 2024 | SEMIEstimated reading time: 1 minute
SEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the construction of Taiwan Semiconductor Manufacturing Company (TSMC) chip manufacturing facilities in Arizona. The award includes $6.6 billion grants, as much as $5 billion in loans and an investment tax credit.
“We applaud the U.S. Department of Commerce for taking this significant step to enhance the resilience of the domestic semiconductor supply chain,” said Joe Stockunas, President of SEMI Americas. “This CHIPS and Science Act award is a key stride towards a 2-nanometer process, positioning the United States to produce the most advanced semiconductor chips at scale in order to advance global supply chain stability and help meet worldwide chip demand across various markets.”
“This grant increases TSMC's total investment in Arizona to $65 billion and is expected to create over 25,000 direct construction and manufacturing jobs, further demonstrating the positive economic impact and job creation potential of such advancements in semiconductor manufacturing,” Stockunas said. “Government investments like the CHIPS and Science Act grant for TSMC play a crucial role in semiconductor manufacturing and are of immense importance to economies globally.”
The recently announced SEMI 300mm Fab Outlook to 2027 report projects the Americas region will double 300mm fab equipment investments from US$12 billion in 2024 to US$24.7 billion in 2027, significantly narrowing the gap with the top three spending regions, which are projected to invest between US$26.3 billion and US$30 billion in chipmaking equipment in 2027.
Suggested Items
Avnet to Exhibit at the 2024 Embedded Vision Summit
05/14/2024 | AvnetAvnet’s exhibit plans for the 2024 Embedded Vision Summit include new development kits supporting AI applications.
Kitron: Completed Share Buyback in Connection with Remuneration to the Board Members
05/14/2024 | KitronKitron ASA has completed share buyback in connection with remuneration to the board members. Reference is made to the stock exchange release by Kitron ASA published on 13. May 2024 regarding initiation of a share buyback program.
Real Time with… IPC APEX EXPO 2024: Digitization and Regular Updates of the iNEMI Industry Roadmap
05/14/2024 | Real Time with...IPC APEX EXPORanjan Chatterjee is a board member at iNEMI. In this conversation with Editor Nolan Johnson, Chatterjee discusses the digitization of, and regular updates to, the industry roadmap. The roadmap is a collaborative effort on technologies and standards which is intended to guide CEOs and CTOs in their long-range planning. Ranjan discusses the board's role in shaping the roadmap and the vision for more frequent updates.
AT&S Adjusts Forecast, Not Considering a Capital Increase, Will Obtain Binding Offers for the Sale of Ansan
05/14/2024 | AT&SAT&S adjusts forecast for the financial year 2026/27, is currently not considering a capital increase, intends to obtain binding offers for the sale of the plant in Ansan, Korea, and proposes not to distribute a dividend for the financial year 2023/24.
KYZEN to Showcase Advanced Packaging Solutions at PCIM Europe 2024
05/14/2024 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany.