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ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave

03/26/2024 | ITW EAE
ITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.

Seeking Employment: Meet Gary Turner

03/25/2024 | Barry Matties, I-Connect007
Meet Gary Turner, a recent graduate from the University of Texas at Dallas with a bachelor’s degree in mechanical engineering and a master’s in material science and engineering. He is currently seeking employment in the industry. The following interview will allow you to learn about Gary and see if he might be a good candidate for a position you are looking to fill.

IMAPS Wrap-up: AI, Chiplets, and 3D Cube Architecture

03/22/2024 | Marcy LaRont, PCB007 Magazine
The International Microelectronics Assembly and Packaging Society, IMAPS, held its 20th Device Packaging Expo and Conference this past week in Fountain Hills, Arizona, followed immediately by a ‘Workshop on Advanced Packaging for Medical Electronics’ that continued through the remainder of Thursday. Fortunate to find myself in Texas earlier in the week, I made it for the last day of the IMAPS event and attended two excellent keynote presentations by AMD and Intel, respectively. Here are some highlights.

Murata to Invest in Apple’s Restore Fund, Aimed at High Quality Carbon Removal

03/20/2024 | Murata
Murata Manufacturing Co., Ltd., has decided to invest up to 30 million USD in Apple’s Restore Fund, an investment fund aimed at generating high quality carbon credits.

Management Change at Mycronic

03/19/2024 | Mycronic
As a result of the preparations ahead of a possible listing of Axxon on a stock exchange in China, effective March 19, 2024, Ivan Li leaves Mycronic’s executive management but remains as Head of Axxon, the core of Mycronic´s High Volume division.
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